Advances in Chemical Mechanical Planarization (CMP)

Szerző: Suryadevara Babu

Nyelv:

Kötés: Kemény kötésű

Kiadó: Elsevier Science & Technology

Elérhetőség: Beszállítói készleten

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Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream...

Információk a könyvről

Szerző

Suryadevara Babu

Nyelv

Angol

Kötés

Könyv - Kemény kötésű

Kiadva

2016

oldal

536

EAN

9780081001653

ISBN

0081001657

Enbook ID

09927831

Kiadó

Elsevier Science & Technology

Súly

690

Méretek

152 x 229 x 30

Teljes leírás

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal filmsIncludes chapters devoted to CMP for particular materialsAddresses consumables and process control for improved CMP

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Advances in Chemical Mechanical Planarization (CMP)

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