Development and Packaging of Microsystems Using Foundry Services

Name: Development and Packaging of Microsystems Using Foundry Services
Brand: Biblioscholar
SKU: 9781286866931
Price: 8857 HUF
Availability: InStock

Szerző: Jeffrey T Butler

Nyelv:

Kötés: Puha kötésű

Kiadó: Biblioscholar

Elérhetőség: Beszállítói készleten

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Micro-electro-mechanical systems (MEMS) is a relatively new and rapidly growing field of research. S...

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Szerző

Jeffrey T Butler

Nyelv

Angol

Kötés

Könyv - Puha kötésű

Kiadva

2012

oldal

328

EAN

9781286866931

ISBN

9781286866931

Enbook ID

08218417

Kiadó

Biblioscholar

Súly

585

Méretek

189 x 246 x 18

Teljes leírás

Micro-electro-mechanical systems (MEMS) is a relatively new and rapidly growing field of research. Several advances to the MEMS and microsystem state of the art were achieved through the design and characterization of novel MEMS devices and packaging, which are compatible with CMOS microelectronics. Empirical and theoretical models of polysilicon thermal actuators were developed to understand and simulate the behavior of thermal actuators. These models can be implemented in microelectronic circuit simulators such as SPICE and allow the simultaneous simulation of thermally actuated MEMS and microelectronics. The most extensive investigation of the Multi-User MEMS Processes (MUMPs) polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity (TCR) of the MUMPs Poly 1 layer was determined as 1.25 x 10-3 K-1. In addition, the sheet resistance of all the MUMPs polysilicon layers was found to be dependent on the linewidth due to the presence or absence of lateral phosphorus diffusion.

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Development and Packaging of Microsystems Using Foundry Services

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