Könyv Electronic Packaging for High Reliability, Low Cost Electronics Rao R. Tummala

Electronic Packaging for High Reliability, Low Cost Electronics

Nyelv: Angol
Kötés: Kemény kötésű
Kiadó: Springer
Elérhetőség: Beszállítói készleten
Küldés 10-13 napon belül
58 925 Ft
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New pac...

Információk a könyvről

Nyelv
Angol
Kötés
Könyv - Kemény kötésű
Kiadva
2000
oldal
296
EAN
9780792352181
ISBN
0792352181
Enbook ID
01395791
Kiadó
Súly
1360
Méretek
155 x 235 x 21

Teljes leírás

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

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