Könyv Embedded Dielectrics for Electronic Packaging Shuhui Yu

Embedded Dielectrics for Electronic Packaging

Nyelv: Angol
Kötés: Kemény kötésű
Elérhetőség: Könyvújdonság
Küldés 31. 03. 2027
64 960 Ft
This book provides an overview of nanocomposite materials that can be used as embedded dielectric la...

Információk a könyvről

Nyelv
Angol
Kötés
Könyv - Kemény kötésű
Kiadva
2015
oldal
300
EAN
9789814619417
ISBN
9814619418
Enbook ID
05349964
Súly
406

Teljes leírás

This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.

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