Könyv High Performance Design Automation For Multi-chip Modules And Packages Paul D Franzon

High Performance Design Automation For Multi-chip Modules And Packages

Szerző: Paul D Franzon
Nyelv: Angol
Kötés: Kemény kötésű
Elérhetőség: 50 % esély
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38 435 Ft
Today's electronics industry requires new design automation methodologies that allow designers to in...

Információk a könyvről

Szerző
Nyelv
Angol
Kötés
Könyv - Kemény kötésű
Kiadva
1996
oldal
264
EAN
9789810223076
ISBN
9810223072
Enbook ID
05065166
Súly
359

Teljes leírás

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages.

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