Könyv High Speed Digital Design Handbook Jared C. Downing

High Speed Digital Design Handbook

Signal Integrity, Transmission Lines, PCB Layout, and High-Frequency Techniques for Practicing Engineers

Szerző: Jared C. Downing
Nyelv: Angol
Kötés: Puha kötésű
Elérhetőség: Várható készletfeltöltés
Küldés 15. 07. 2026
29 313 Ft
For Every Engineer Losing Sleep Over Signal IntegrityYour PCB traces are transmission lines. Your p...

Információk a könyvről

Nyelv
Angol
Kötés
Könyv - Puha kötésű
Kiadva
2026
oldal
372
EAN
9798186716525
Enbook ID
53210200
Súly
862
Méretek
216 x 280 x 20

Teljes leírás

For Every Engineer Losing Sleep Over Signal Integrity

Your PCB traces are transmission lines. Your power planes resonate. Your eye diagram is closing. And your datasheet does not tell you why or what to do about it.

At 1 GHz, every wire on your board stops behaving like a wire. At 10 GHz and beyond, the rules you learned in university fail completely. This is the handbook that closes that gap the one between what school taught and what your job actually demands.

What Is Inside

14 chapters. 350+ pages. Every concept derived from first principles, then applied with worked numbers:

  • Transmission line theory - why traces ring, reflect, and radiate, derived from Maxwell's equations
  • PCB stackup design - controlled impedance formulas for microstrip, stripline, and differential pairs
  • Signal degradation - ISI, jitter, eye diagrams, bathtub curves, and BER prediction
  • Crosstalk - NEXT, FEXT, the 3W rule, and guard trace design with quantified isolation
  • Differential signaling - LVDS, CML, SerDes architecture, mode conversion, and skew matching
  • Power delivery networks - target impedance, decoupling hierarchy, plane resonance, and SSN
  • Measurement techniques - TDR, VNA, oscilloscope, BERT, and compliance testing
  • Memory interfaces - DDR4, DDR5, LPDDR5 fly-by routing, write leveling, and timing margins
  • Serial interfaces - PCIe Gen 1-7, USB4, 400G/800G Ethernet, SATA, SAS equalization
  • EMC and EMI - radiated emissions, FCC/CISPR limits, shielding, filtering, and SSCG
  • Via and connector design - stub resonance, back-drilling, BGA fanout, and backplane budgeting
  • SI simulation - SPICE, IBIS-AMI, 3D EM solvers, pre/post-layout correlation
  • Thermal effects - copper resistivity vs. temperature, hot-corner IL derating, PDN cold-start
  • Emerging interfaces - PCIe Gen 6/7, UCIe die-to-die, 1.6T Ethernet, co-packaged optics

Who This Book Is For
  • PCB designers and layout engineers who need to know why the rules exist, not just what they are
  • Hardware engineers debugging boards that fail at temperature, speed, or compliance test
  • Firmware and system engineers who need to speak SI fluently with their hardware counterparts
  • Students and exam candidates preparing for professional engineering certification
  • Technical leads who review schematics and layouts and need quantified pass/fail criteria
Every chapter opens with learning objectives and closes with fully worked practice problems and complete boxed solutions. No concept is left as a formula without a number. No design rule is given without the physics that explains it.