Integrated Circuit Packaging, Assembly and Interconnections

Name: Integrated Circuit Packaging, Assembly and Interconnections
Brand: Springer-Verlag New York Inc.
SKU: 9780387281537
Price: 41534 HUF
Availability: InStock

Trends and Options

Szerző: William J. Greig

Nyelv:

Kötés: Kemény kötésű

Kiadó: Springer-Verlag New York Inc.

Elérhetőség: Beszállítói készleten alacsony példányszámban

Küldés 13-18 napon belül

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Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, ser...

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Szerző

William J. Greig

Nyelv

Angol

Kötés

Könyv - Kemény kötésű

Kiadva

2007

oldal

300

EAN

9780387281537

ISBN

0387281533

Enbook ID

01381449

Kiadó

Springer-Verlag New York Inc.

Súly

1400

Méretek

155 x 235 x 24

Teljes leírás

Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.§The focus is on the electronic manufacturing process which, in its simplest form, involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes. §This material will provide a suitable knowledge-base essential for individuals who have the need or interest in understanding the basics of electronic manufacturing.

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Integrated Circuit Packaging, Assembly and Interconnections

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