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Könyv Lead Free Solder John Hock Lye Pang

Lead Free Solder

Mechanics and Reliability

Szerző: John Hock Lye Pang
Nyelv: Angol
Kötés: Kemény kötésű
Kiadó: Springer-Verlag New York Inc.
Elérhetőség: Beszállítói készleten
Küldés 10-13 napon belül
37 283 Ft
Lead-free solders are used extensively as interconnection materials in electronic assemblies and pla...

Információk a könyvről

Szerző
John Hock Lye Pang
Nyelv
Angol
Kötés
Könyv - Kemény kötésű
Kiadva
2011
oldal
175
EAN
9781461404620
ISBN
1461404622
Enbook ID
01426766
Kiadó
Springer-Verlag New York Inc.
Súly
453
Méretek
155 x 235 x 16

Teljes leírás

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: §Discusses the mechanical properties of the lead-free solder materials used in the industryFocuses on mechanics of materials theory inelastic, plastic, creep, fatigue and fracture assessments Presents materials testing and characterization for bulk solder, solder joint and soldered assemblyDetails how to use reliability test and analysis for thermal cycling, cyclic bending and drop impactLead Free Solder: Mechanics and Reliability is an ideal book for engineers working with semiconductor packaging and in the electronic manufacturing industry.

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