Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990

Name: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
Brand: Cambridge University Press
SKU: 9781107408715
Price: 14864 HUF
Availability: InStock

Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.

Szerző: Qinghuang Lin, E. Todd Ryan, Wen-li Wu, Do Yeung Yoon

Nyelv:

Kötés: Puha kötésű

Kiadó: Cambridge University Press

Elérhetőség: Beszállítói készleten

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In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass prod...

Információk a könyvről

Szerző

Qinghuang Lin, E. Todd Ryan, Wen-li Wu, Do Yeung Yoon

Nyelv

Angol

Kötés

Könyv - Puha kötésű

Kiadva

2014

oldal

358

EAN

9781107408715

ISBN

1107408717

Enbook ID

02439059

Kiadó

Cambridge University Press

Súly

Méretek

152 x 229 x 19

Teljes leírás

In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange the latest advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addressed interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990

Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.

Információk a könyvről

Teljes leírás

Érdekelheti

Azok a vásárlók, akik ezt a könyvet megvásárolták, a következőket is megvásárolták