Physical Design for Multichip Modules

Name: Physical Design for Multichip Modules
Brand: Springer, Berlin
SKU: 9780792394501
Price: 63442 HUF
Availability: InStock

Szerző: Mysore Sriram, Sung-Mo (Steve) Kang

Nyelv:

Kötés: Kemény kötésű

Kiadó: Springer, Berlin

Elérhetőség: Beszállítói készleten alacsony példányszámban

Küldés 13-18 napon belül

63 442 Ft

Physical Design for Multichip Modules collects together a large body of important research work that...

Információk a könyvről

Szerző

Mysore Sriram, Sung-Mo (Steve) Kang

Nyelv

Angol

Kötés

Könyv - Kemény kötésű

Kiadva

1994

oldal

197

EAN

9780792394501

ISBN

079239450X

Enbook ID

01398239

Kiadó

Springer, Berlin

Súly

490

Méretek

156 x 234 x 15

Teljes leírás

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.

Érdekelheti

Azok a vásárlók, akik ezt a könyvet megvásárolták, a következőket is megvásárolták

Leggyakrabban keresett

Categories

Authors

Publishers

Termékek

Termékek

Leggyakrabban keresett

Categories

Authors

Publishers

Termékek

Termékek

Physical Design for Multichip Modules

Információk a könyvről

Teljes leírás

Érdekelheti

Azok a vásárlók, akik ezt a könyvet megvásárolták, a következőket is megvásárolták