Semiconductor Wafer Bonding - Science and Technology

Szerző: Q.Y. Tong, Ulrich Gosele

Nyelv:

Kötés: Kemény kötésű

Kiadó: John Wiley & Sons Inc

Elérhetőség: Beszállítói készleten

Küldés 9-15 napon belül

70 186 Ft

A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and elect...

Információk a könyvről

Szerző

Q.Y. Tong, Ulrich Gosele

Nyelv

Angol

Kötés

Könyv - Kemény kötésű

Kiadva

1998

oldal

320

EAN

9780471574811

ISBN

0471574813

Enbook ID

04892270

Kiadó

John Wiley & Sons Inc

Súly

654

Méretek

165 x 236 x 24

Teljes leírás

A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more. This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others. For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.

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Semiconductor Wafer Bonding - Science and Technology

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