Thermal Stress and Strain in Microelectronics Packaging

Name: Thermal Stress and Strain in Microelectronics Packaging
Brand: Springer-Verlag New York Inc.
SKU: 9781468477696
Price: 57766 HUF
Availability: InStock

Szerző: John Lau

Nyelv:

Kötés: Puha kötésű

Kiadó: Springer-Verlag New York Inc.

Elérhetőség: Beszállítói készleten

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Microelectronics packaging and interconnection have experienced exciting growth stimulated by the re...

Információk a könyvről

Szerző

John Lau

Nyelv

Angol

Kötés

Könyv - Puha kötésű

Kiadva

2012

oldal

884

EAN

9781468477696

ISBN

1468477692

Enbook ID

02723067

Kiadó

Springer-Verlag New York Inc.

Súly

1305

Méretek

152 x 229 x 48

Teljes leírás

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

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Thermal Stress and Strain in Microelectronics Packaging

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